AccuThermo AW 820M Rapid Thermal Process equipment

Manufacturer: Allwin21 Corp.

Condition: New

Wafer Size: Small~8 inch

Type: Stand Alone, Atmospheric

Temperature: 100~800°C or 450~1250°C. Long time and Higher temperature processes are available. Pls contact us for detail.

Lamp Zones: 10 from Jan. 2022

Gas Lines: 1 ~ 6 lines

Options: Integrated solid robotic wafer transfer ; SMIF (Standard Mechanical Interface) load port transfer. Add Double O Ring and/or O2 Sensor/Analyzer for O2 sensitive applications and saving GaAs, InP, GaN, GaInP, SiC and other valuable compound material wafers .

Chamber Design: Allwin21

PowerSum Function: Save valuable compound material wafers.

RTP Main Customers: Link

Free Fast Quote: Link

Please fill in the RFQs ( RTP )at our website for Fast Free Quotes. Appreciate your time.

1. Allwin21 Brochures: Rapid Thermal Processors
2. PPT on Why AccuThermo AW 610M RTP
3. PPT on Why AccuThermo AW820M RTP
4. PPT on Why do not buy RTP with vacuum function
5. Video on Why AccuThermo AW610M RTP
6. Video on Why AccuThermo AW820M RTP
7. Video on AccuThermo AW610
8. Video on why do not buy RTP with vacuum function

For many years AG Associates was the dominant manufacturer of RTP systems. It was founded in 1981 and produced the first single wafer RTP system in 1982, the Heatpulse 210. In 1987, it produced the Heatpulse 610. These RTP systems run at atmospheric pressure and rely on a pre-process nitrogen or argon purge prior to wafer processing. They are still being used around the world in manufacturing, R&D and Universities. These RTP systems have a proven track record for reliability and simplicity.

 

Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermo Processors.Compared with traditional RTP systems, Allwin21″s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the best rapid thermal processing performance ( repeatability , uniformity and Stability etc.).

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